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| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC2721, PC2722 GENERAL PURPOSE L-BAND DOWN CONVERTER ICs DESCRIPTION The PC2721/2722 are Silicon monolithic ICs designed for L-band down converter. These ICs consist of double balanced mixer, local oscillator, local oscillation buffer amplifier, IF amplifier, and voltage regulator. The packages are 8 pin SOP or SSOP suitable for high-density surface mount. FEATURES * Wide band operation fRF = 0.9 to 2.0 GHz * Two products in IF output variation are prepared PC2721: Emitter follower output type = 50 constant resistive impedance PC2722: Open collector output type = High impedance output dependent on external inductance. * Single-end push-pull IF amplifier suppresses fluctuation in output impedance. * Supply voltage: 5 V * Low current consumption (PC2721: ICC = 38 mA typ., PC2722: ICC = 28 mA typ.) * Packaged in 8 pin SOP or SSOP suitable for high-density mounting ORDERING INFORMATION PART NUMBER PACKAGE 8 pin Plastic SOP (225 mil) PACKAGE STYLE Embossed tape 12 mm wide 2.5 k/REEL. Pin 1 indicates pull-out direction of tape. Embossed tape 12 mm wide 2.5 k/REEL. Pin 1 indicates roll-in direction of tape. Embossed tape 8 mm wide 1 k/REEL. Pin 1 indicates pull-out direction of tape. PC2721GR-E1 PC2722GR-E1 PC2721GR-E2 PC2722GR-E2 PC2721GV-E1 PC2722GV-E1 8 pin Plastic SOP (225 mil) 8 pin Plastic SSOP (175 mil) For evaluation sample order, please contact your local NEC office. (Part number for sample order: PC2721GR, PC2722GR, PC2721GV, PC2722GV) Caution electro-static sensitive device The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P11102EJ4V0DS00 (4th edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. (c) 1996, 1999 PC2721, PC2722 INTERNAL BLOCK DIAGRAM 8 7 6 5 PIN CONFIGURATION (Top View) 1 2 OSC OSC Buffer 8 7 6 5 1. OSC base (bypass) 2. OSC base (feedback) 3. OSC collector (coupling) 4. VCC 5. IF output 6. GND 7. RF input 2 (bypass) 8. RF input 1 3 4 1 2 3 4 2 Data Sheet P11102EJ4V0DS00 PC2721, PC2722 PIN No. 1 SYMBOL OSC base (bypass) PIN VOLT TYP.(V) 2.9 Function and Explanation Internal oscillator consists in balance amplifier. 2 pin and 3 pin should be externally equipped with tank resonator circuit in order to oscillate with feedback loop. 1 pin should be grounded through coupling capacitor to 0.5 pF. 3 pin is defined as open collector. This pin should be coupled through resistor or chock coil in order to adjust Q and be supplied voltage. In case of abnormal oscillation, adjust its Q lower to stabilize the operation. Equivalent circuit 2 VCC 3 1 2 OSC base (feedback) 2.9 3 OSC collector (coupling) 5.0 4 5 VCC IF output 5.0 Supply voltage pin for the IC. In PC2721, IF amplifier is designed as single-end push-pull amplifier. This pin is assigned for the emitter follower output with 50 constant resistive impedance in wide band. PC2721 2.9 PC2721 5 PC2722 5.0 In PC2722, IF amplifier is designed as balance amplifier. This pin is assigned for the open collector output with high impedance dependent on external inductance. PC2722 5 6 7 GND RF input 2 (bypass) 0.0 2.4 GND pin for the IC. 7 pin and 8 pin are inputs for mixer designed as double balanced type. Either pin can be assigned for input and another for ground. 7 8 8 RF input 1 2.4 Data Sheet P11102EJ4V0DS00 3 PC2721, PC2722 ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage Power Dissipation Operating temperature range Storage temperature range SYMBOL VCC PD TA Tstg RATING 6.0 250 -40 to +85 -65 to +150 UNIT V mW C C TEST CONDITION TA = 25 C TA = 85 C Note 1 Note 1: Mounted on 50 x 50 x 1.6 mm double copper clad epoxy glass board. RECOMMENDED OPERATING RANGE PARAMETER Supply Voltage Operating temperature range SYMBOL VCC TA MIN. 4.5 -40 TYP. 5.0 +25 Note 2 MAX. 5.5 +85 UNIT V C ELECTRICAL CHARACTERISTICS (VCC = 5.0 V, TA = +25 C PC2721 MIN. Circuit Current Lower Input Frequency Upper Input Frequency Conversion Gain 1 Conversion Gain 2 Noise Figure 1 Noise Figure 2 Maximum output power 1 Maximum output power 2 ICC fRF1 fRF2 CG1 CG2 NF1 NF2 PO(SAT)1 PO(SAT)2 2.0 18 18 - - +2 +2 21 21 9 11 +7 +7 24 24 13 15 - - 29 TYP. 38 MAX 45.5 0.9 ) PARAMETER SYMBOL PC2722 MIN. 19 TYP. 28 MAX 37 0.9 2.0 15 15 - - +2 +2 18 18 9 9 +6 +6 21 21 13 13 - - UNIT mA GHz GHz dB dB dB dB dBm dBm TEST CONDITIONS no input signal fIF = 50 to 600 MHz (C2721) fIF = DC to 600 MHz (C2722) fRF = 900 MHz, fIF = 402.8 MHz fRF = 2.0 GHz, fIF = 402. 8 MHz fRF = 900 MHz, fIF = 402.8 MHz fRF = 2.0 GHz, fIF = 402.8 MHz fRF = 900 MHz, fIF = 402.8 MHz fRF = 2.0 GHz, fIF = 402.8 MHz Note 2: on test circuit STANDARD CHARACTERISTICS (FOR REFERENCE) (VCC = 5 V, TA = 25 C REFERENCE VALUES Note 2 ) PARAMETER Conversion Gain 3 Conversion Gain 4 Conversion Gain 5 Conversion Gain 6 Conversion Gain 7 Conversion Gain 8 Third Intermodulation Distortion 1 Third Intermodulation Distortion 2 SYMBOL CG3 CG4 CG5 CG6 CG7 CG8 IM31 IM32 UNIT dB dB dB dB dB dB dBc dBc TEST CONDITIONS fRF = 900 MHz, fIF = 50 MHz fRF = 2.0 MHz, fIF = 50 MHz fRF = 900 MHz, fIF = 479.5 MHz fRF = 2.0 MHz, fIF = 479.5 MHz fRF = 900 MHz, fIF = 600 MHz fRF = 2.0 MHz, fIF = 600 MHz fRF = 900, 938 MHz, Pin = -30 dBm fRF = 2.0, 2.038 GHz, Pin = -30 dBm PC2721 22 22 21 21 19.5 19.5 38.0 38.0 PV2722 19 19 18 18 17 17 42.0 42.0 4 Data Sheet P11102EJ4V0DS00 PC2721, PC2722 TYPICAL CHARACTERISTICS (TA = +25 C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 60 No input signal Pout - Output Power - dBm ICC - Circuit Current - mA 50 40 30 20 +5 0 -5 -10 -15 -20 -40 C2 72 1 2 OUTPUT POWER vs. INPUT POWER +10 fRF = 2.0 GHz fRF = 900 MHz fRF = 2.0 GHz fRF = 900 MHz 72 PC2721 P PC2722 10 P C2 VCC = 5 V fIF = 402 MHz On test circuit -30 -20 -10 0 +10 +20 0 1 2 3 4 5 6 VCC - Supply Voltage - V Pin - Input Power - dBm CONVERSION GAIN AND NOISE FIGURE vs. INPUT FREQUENCY 30 CG - Conversion Gain - dB 25 NF - Noise Figure - dB 20 15 10 5 0 25 CG 20 15 10 5 VCC = 5 V PRF = -30 dBm POSC = -5 dBm fIF = 402 MHz On test circuit CONVERSION GAIN vs. IF FREQUENCY 30 CG - Conversion Gain - dB 25 20 15 10 VCC = 5 V POSC = 0 dBm 5 PRF = -30 dBm On test circuit 0 100 200 300 400 500 600 fRF = 2.0 GHz PC2721 PC2722 PC2721 PC2722 NF PC2721 fRF = 900 MHz 0 0.5 1.0 1.5 2.0 2.5 3.0 fin - Input Frequency - GHz fIF - IF Frequency - MHz IM3 AND OUTPUT POWER vs. INPUT POWER +10 0 Pout - Output Power - dBm -10 -20 -30 -40 -50 -60 -40 Pout - Output Power - dBm +10 0 -10 -20 -30 IM3 AND OUTPUT POWER vs. INPUT POWER PC2721 fRF1 = 900 MHz fRF2 = 938 MHz fOSC = 1.3 GHz fRF1 = 2.0 GHz fRF2 = 2.038 GHz fOSC = 2.4 GHz VCC = 5 V PC2722 -40 -50 -60 -40 fRF1 = 900 MHz fRF2 = 938 MHz fOSC = 1.3 GHz fRF1 = 2.0 GHz fRF2 = 2.038 GHz fOSC = 2.4 GHz VCC = 5 V -30 -20 -10 0 -30 -20 -10 0 Pin - Input Power - dBm Pin - Input Power - dBm Data Sheet P11102EJ4V0DS00 5 PC2721, PC2722 OSC-TUNING VOLTAGE vs. OSC FREQUENCY VCC = 5 V fIF = 402 MHz LOWER VCC VOLTAGE IN OSC OPERATION vs. OSC FREQUENCY V - Oscillation stop (start) Voltage - V 20 5 VTU - Tuning Voltage - V 15 4 3 10 2 5 1 0 1.0 1.2 1.4 1.6 1.8 2.0 2.2 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 fOSC - Oscillation Frequency - GHz fOSC - Oscillation Frequency - GHz PC2721 OSC FREQUENCY STABILITY vs. OSC FREQUENCY Fstb - Oscillation Frequency Stability - MHz +6.0 VCC = 4.5 V +4.0 +2.0 0 VCC = 5.5 V -2.0 -4.0 -6.0 1.4 VCC = 4.5 V VCC = 5.5 V PC2722 OSC FREQUENCY STABILITY vs. OSC FREQUENCY Fstb - Oscillation Frequency Stability - MHz +6.0 +4.0 +2.0 0 -2.0 -4.0 -6.0 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 fOSC - Oscillation Frequency - GHz VCC = 5.5 V VCC = 4.5 V VCC = 4.5 V VCC = 5.5 V 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 fOSC - Oscillation Frequency - GHz 6 Data Sheet P11102EJ4V0DS00 PC2721, PC2722 TEST CIRCUIT S.G 100 pF 1 S.G 0.5 pF 2 8 50 50 100 pF 10 7 PC2721 3 6 20 pF 2 pF 100 1 000 pF 100 pF 20 pF 4 5 50 Spectrum analyzer 5.0 V APPLICATION CIRCUIT FOR REFERENCE 100 pF 1 0.5 pF 47 k L4 2 2 pF 1SV210 L2 Note RF IN 8 7 2 pF 47 270 100 pF 4 20 pF 3 PC2721 6 20 pF 2 pF 1 000 pF 5 IF OUT 5.0 V Note Our varactor diodes are discontinued. For varactor diode, contact other supplier. L2: 0.3 mm 2.0 mm 10T L4: 0.4 mm, = 4 mm The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet P11102EJ4V0DS00 7 PC2721, PC2722 TEST CIRCUIT S.G 100 pF 1 S.G 0.5 pF 2 50 100 pF 10 3 100 4 100 pF 20 pF 5 0.8 pF 1.5 pF L1 1.8 H 50 Spectrum analyzer 7 8 50 PC2722 6 20 pF 2 pF L1 1 000 pF 5.0 V L1: 0.4 mm 4.0 mm 3T APPLICATION CIRCUIT FOR REFERENCE 100 pF 1 0.5 pF 47 k L4 2 2 pF 1SV210 L2 Note RF IN 8 7 2 pF 47 270 4 100 pF 20 pF 3 PC2722 6 20 pF 2 pF 1 000 pF IF OUT 5 5.0 V Note Our varactor diodes are discontinued. For varactor diode, contact other supplier. L1: 0.4 mm 4.0 mm 3T L2: 0.3 mm 2.0 mm 10T L4: 0.4 mm, = 4 mm The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 8 Data Sheet P11102EJ4V0DS00 PC2721, PC2722 PACKAGE DIMENSIONS 8 PIN PLASTIC SOP (225 mil) (UNIT: mm) 8 5 detail of lead end 3-3 +7 1 5.2 0.2 4 6.5 0.3 1.57 0.2 1.49 4.4 0.15 1.1 0.2 0.85 MAX. 1.27 0.42 -0.07 0.1 0.1 +0.08 0.6 0.2 0.17 -0.07 +0.08 0.10 0.12 M NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. Data Sheet P11102EJ4V0DS00 9 PC2721, PC2722 8 PIN PLASTIC SSOP (175 mil) (UNIT: mm) 8 5 detail of lead end 3-3 +7 1 3.00 MAX 4 4.94 0.2 1.8 MAX 1.5 0.1 3.2 0.1 0.87 0.2 0.575 MAX. 0.65 0.3 -0.05 0.1 0.1 +0.10 0.5 0.2 0.15 -0.05 +0.10 0.15 0.10 M NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. 10 Data Sheet P11102EJ4V0DS00 PC2721, PC2722 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions. For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). PC2721/22 Soldering process Infrared ray reflow Soldering conditions Peak package's surface temperature: 235 C or below, Reflow time: 30 seconds or below (210 C or higher), Note Number of reflow process: 3, Exposure limit : None Peak package's surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), Note Number of reflow process: 3, Exposure limit : None Solder temperature: 260 C or below, Flow time: 10 seconds or below, Note Number of flow process: 1, Exposure limit : None Terminal temperature: 300 C or below, Flow time: 3 seconds or below, Exposure limitNote: None Symbol IR35-00-3 VPS VP15-00-3 Wave soldering WS60-00-1 Partial heating method Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Caution Do not apply more than single process at once, except the "Partial heating method". Data Sheet P11102EJ4V0DS00 11 PC2721, PC2722 NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. * The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8 |
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